The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Aug. 16, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Ming-Tung Wu, Hsinchu, TW;
Chun-Kai Lan, Hsinchu, TW;
Tung-He Chou, Hsinchu, TW;
Hsun-Chung Kuang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/67 (2006.01); B24B 37/04 (2012.01); B24B 37/16 (2012.01); C25F 7/00 (2006.01); H01L 21/3063 (2006.01); C25F 3/12 (2006.01); B24B 37/015 (2012.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30625 (2013.01); B24B 37/015 (2013.01); B24B 37/042 (2013.01); B24B 37/046 (2013.01); B24B 37/16 (2013.01); C25F 3/12 (2013.01); C25F 7/00 (2013.01); H01L 21/304 (2013.01); H01L 21/3063 (2013.01); H01L 21/67086 (2013.01);
Abstract
A planarization apparatus is provided. The planarization apparatus includes a platen, and a grinding wheel. The platen is configured to support a wafer. The grinding wheel is over the platen and configured to grind the wafer. The grinding wheel includes a base ring, and a plurality of grinding teeth mounted on the base ring. The plurality of grinding teeth includes a plurality of grinding abrasives, and the plurality of grinding abrasives is ball type.