The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Feb. 25, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Albert Wan, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Chao-Wen Shih, Hsinchu County, TW;
Han-Ping Pu, Taichung, TW;
Hsin-Yu Pan, Taipei, TW;
Sen-Kuei Hsu, Kaohsiung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor device including a chip package and an antenna package disposed on the chip package is provided. The chip package includes a semiconductor chip, an encapsulation enclosing the semiconductor chip, and a redistribution structure disposed on the semiconductor chip and the encapsulation and electrically coupled to the semiconductor chip. The antenna package includes an antenna pattern electrically coupled to the chip package, and an intermediate structure disposed between the antenna pattern and the chip package, wherein the intermediate structure comprises a ceramic element in contact with the redistribution structure and thermally dissipating a heat generated from the semiconductor chip.