The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Sep. 30, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Elijah V. Karpov, Portland, OR (US);

Roza Kotlyar, Portland, OR (US);

Prashant Majhi, San Jose, CA (US);

Jeffery D. Bielefeld, Forest Grove, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 13/00 (2006.01); H01L 27/24 (2006.01); H01L 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 45/08 (2013.01); G11C 13/0011 (2013.01); H01L 27/2436 (2013.01); H01L 27/2463 (2013.01); H01L 45/085 (2013.01); H01L 45/1233 (2013.01); H01L 45/1266 (2013.01); H01L 45/141 (2013.01); H01L 45/142 (2013.01); H01L 45/144 (2013.01); H01L 45/145 (2013.01); H01L 45/146 (2013.01); H01L 45/1616 (2013.01); H01L 45/1625 (2013.01); G11C 2013/0073 (2013.01); G11C 2213/33 (2013.01); G11C 2213/34 (2013.01); G11C 2213/35 (2013.01); G11C 2213/56 (2013.01); G11C 2213/79 (2013.01);
Abstract

Conductive bridge random access memory (CBRAM) devices with low thermal conductivity electrolyte sublayers are described. In an example, a conductive bridge random access memory (CBRAM) device includes a conductive interconnect disposed in an inter-layer dielectric (ILD) layer disposed above a substrate. The CBRAM device also includes a CBRAM element disposed on the conductive interconnect. The CBRAM element includes an active electrode layer disposed on the conductive interconnect, and a resistance switching layer disposed on the active electrode layer. The resistance switching layer includes a first electrolyte material layer disposed on a second electrolyte material layer, the second electrolyte material layer disposed on the active electrode layer and having a thermal conductivity lower than a thermal conductivity of the first electrolyte material layer. A passive electrode layer is disposed on the first electrolyte material of the resistance switching layer.


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