The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Sep. 26, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Ker Hsiao Huo, Zhubei, TW;

Fu-Chih Yang, Fengshan, TW;

Chun Lin Tsai, Hsin-Chu, TW;

Yi-Min Chen, Hsinchu, TW;

Chih-Yuan Chan, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 29/40 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 27/02 (2006.01); H01L 27/06 (2006.01); H01L 49/02 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0288 (2013.01); H01L 21/823437 (2013.01); H01L 21/823456 (2013.01); H01L 21/823475 (2013.01); H01L 21/823493 (2013.01); H01L 27/0629 (2013.01); H01L 28/20 (2013.01); H01L 29/0692 (2013.01); H01L 29/0696 (2013.01); H01L 29/405 (2013.01); H01L 29/41758 (2013.01); H01L 23/5228 (2013.01); H01L 29/4175 (2013.01); H01L 29/4238 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Some embodiments relate to a method. In the method, a semiconductor substrate is provided. Dopant impurities of a first dopant conductivity are implanted into the semiconductor substrate to form a body region. A gate dielectric and a field oxide region are formed over the semiconductor substrate. A polysilicon layer is formed over the gate dielectric and field oxide region. The polysilicon layer is patterned to concurrently form a conductive gate electrode over the gate dielectric and a resistor structure over the field oxide region. The resistor structure is perimeterally bounded by an inner edge of the conductive gate electrode. Dopant impurities of a second dopant conductivity, which is opposite the first dopant conductivity, are implanted into the semiconductor substrate to form a source region and a drain region. The drain region is perimeterally bounded by the inner edge of the conductive gate electrode.


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