The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Mar. 21, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tuan-Yu Hung, Changhua County, TW;

Hung-Jui Kuo, Hsinchu, TW;

Ming-Che Ho, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/02 (2006.01); C25D 5/08 (2006.01); C25D 17/06 (2006.01); H01L 21/28 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
C25D 17/02 (2013.01); C25D 5/08 (2013.01); C25D 17/06 (2013.01); H01L 21/2885 (2013.01);
Abstract

A plating apparatus includes a plating bath, a substrate holder, an anode electrode, and a fluid stirring member. The plating bath is configured to contain a plating solution. The substrate holder is configured to hold a substrate to be plated in the plating bath. The anode electrode is disposed in the plating bath. The fluid stirring member is disposed between the anode electrode and the substrate to be plated, and includes a plurality of first stirring stripes a plurality of second stirring stripes. The first stirring stripes extend along a first direction parallel to a plating surface of the substrate to be plated. The second stirring stripes extend along a second direction intersected with the plurality of first stirring stripes and parallel to the plating surface, wherein the fluid stirring member is configured to reciprocate along the first direction and the second direction.


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