The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Mar. 05, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Zhenjiang Cui, San Jose, CA (US);

Nitin Ingle, San Jose, CA (US);

Feiyue Ma, San Jose, CA (US);

Hanshen Zhang, Cupertino, CA (US);

Siliang Chang, San Jose, CA (US);

Daniella Holm, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 27/10 (2006.01); H01L 21/02 (2006.01); H01L 27/02 (2006.01); H01L 21/285 (2006.01); H01L 21/3213 (2006.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01J 37/32091 (2013.01); H01J 37/32357 (2013.01); H01J 37/32449 (2013.01); H01J 37/32788 (2013.01); H01J 37/32972 (2013.01); H01L 21/0262 (2013.01); H01L 21/02274 (2013.01); H01L 21/28518 (2013.01); H01L 21/32135 (2013.01); H01L 27/0203 (2013.01); H01L 27/10 (2013.01); H01J 2237/3347 (2013.01); H01L 21/02244 (2013.01); H01L 21/02252 (2013.01); H01L 21/02255 (2013.01); H01L 27/11582 (2013.01);
Abstract

Exemplary methods for etching a variety of metal-containing materials may include flowing an oxygen-containing precursor into a semiconductor processing chamber. A substrate positioned within the semiconductor processing chamber may include a trench formed between two vertical columns and a metal-containing material arranged within a plurality of recesses defined by the two vertical columns. The plurality of recesses may include a first recess and a second recess adjacent to the first recess. The metal-containing material arranged within the first recess and the metal-containing material arranged within the second recess may be connected by the metal-containing material lining a portion of sidewalls of the trench. The methods may further include oxidizing the metal-containing material with the oxygen-containing precursor. The methods may also include flowing a halide precursor into the semiconductor processing chamber. The methods may further include laterally etching the oxidized metal-containing material lining the portion of the sidewalls of the trench.


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