The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Mar. 21, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Chun-Kai Lan, Hsinchu, TW;
Tung-He Chou, Hsinchu, TW;
Ming-Tung Wu, Hsinchu, TW;
Sheng-Chau Chen, Tainan, TW;
Hsun-Chung Kuang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/00 (2006.01); B24B 53/017 (2012.01); B24B 53/12 (2006.01); H01L 21/306 (2006.01); B24B 37/27 (2012.01); B24B 37/24 (2012.01); B24B 37/005 (2012.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24B 37/005 (2013.01); B24B 37/245 (2013.01); B24B 37/27 (2013.01); B24B 53/12 (2013.01); H01L 21/30625 (2013.01);
Abstract
An apparatus for chemical mechanical polishing includes a pad conditioner. The pad conditioner includes a first disk having a first surface and a second disk having a second surface. The first surface has a first plurality of abrasives with a first mean size and the second surface has a second plurality of abrasives with a second mean size greater than the first mean size.