The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Nov. 13, 2018
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Jason Kirkwood, Mountain View, CA (US);

Jan Lauber, San Francisco, CA (US);

Assignee:

KLA Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G06T 7/00 (2017.01); G06K 9/62 (2006.01); G06T 7/50 (2017.01); G06T 7/60 (2017.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); G06K 9/6256 (2013.01); G06K 9/6267 (2013.01); G06T 7/0004 (2013.01); G06T 7/50 (2017.01); G06T 7/60 (2013.01); G06T 2207/10024 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/20212 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A system for defect detection and analysis is provided. The system may include an inspection sub-system and a controller including a memory and one or more processors. The inspection sub-system may include an illumination source and one or more detectors configured to acquire control patch images of defects of a control specimen along one or more detector channels. The one or more processors may be configured to train a defect classifier using the control patch images and known parameters associated with the defects of the control specimen. The inspection sub-system may be further configured to acquire patch images of identified defects on an additional specimen. The one or more processors may be configured to determine parameters of the identified defects using the defect classifier.


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