The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Jan. 08, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Zhenjiang Cui, San Jose, CA (US);

Nitin Ingle, San Jose, CA (US);

Feiyue Ma, Santa Clara, CA (US);

Hanshen Zhang, Santa Clara, CA (US);

Siliang Chang, Santa Clara, CA (US);

Daniella Holm, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 27/10 (2006.01); H01L 21/02 (2006.01); H01L 27/02 (2006.01); H01L 21/285 (2006.01); H01L 21/3213 (2006.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01J 37/32091 (2013.01); H01J 37/32357 (2013.01); H01J 37/32449 (2013.01); H01J 37/32788 (2013.01); H01J 37/32972 (2013.01); H01L 21/0262 (2013.01); H01L 21/02274 (2013.01); H01L 21/28518 (2013.01); H01L 21/32135 (2013.01); H01L 27/0203 (2013.01); H01L 27/10 (2013.01); H01J 2237/3347 (2013.01); H01L 21/02244 (2013.01); H01L 21/02252 (2013.01); H01L 21/02255 (2013.01); H01L 27/11582 (2013.01);
Abstract

Exemplary methods for laterally etching tungsten may include flowing an oxygen-containing precursor into a semiconductor processing chamber. A substrate positioned within the semiconductor processing chamber may include a trench formed between two vertical columns and tungsten slabs arranged within a plurality of recesses defined by at least one of the two vertical columns. At least two of the tungsten slabs may be connected by tungsten lining a portion of sidewalls of the trench. The methods may further include oxidizing the tungsten connecting the at least two of the tungsten slabs with the oxygen-containing precursor. The methods may include flowing a halide precursor into the semiconductor processing chamber. The methods may also include laterally etching the oxidized tungsten from the sidewalls of the trench.


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