The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Jul. 17, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jesse C. Jones, Chandler, AZ (US);

Gang Duan, Chandler, AZ (US);

Jason Gamba, Gilbert, AZ (US);

Yosuke Kanaoka, Phoenix, AZ (US);

Rahul N. Manepalli, Chandler, AZ (US);

Vishal Shajan, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/538 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/76224 (2013.01); H01L 23/5386 (2013.01); H01L 2223/54426 (2013.01);
Abstract

An electronic device includes a substrate, and the substrate may include one or more layers. The one or more layers may include a dielectric material and may include one or more electrical traces. The electronic device may include a layer of conductive material, and the layer of conductive material may define a void in the conductive material. The electronic device may include a fiducial mark, and the fiducial mark may include a filler material positioned in the void defined by the conductive material. The fiducial mark may be coupled to the layer of conductive material. The filler material may have a lower reflectivity in comparison to the conductive material, for instance to provide a contrast with the conductive material.


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