The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Sep. 28, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Saeed Shojaie, Folsom, CA (US);
Hyoung Il Kim, Folsom, CA (US);
Bilal Khalaf, Folsom, CA (US);
Min-Tih Ted Lai, Folsom, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/495 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4952 (2013.01); H01L 23/00 (2013.01); H01L 23/495 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/06133 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48993 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/85186 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A bond-wire system including a wire bond that is deflected above a dielectric ridge at a die edge. The deflected wire bond allows for both a lowered Z-profile and a reduced X-Y footprint. The bond-wire system may include a stacked-die configuration where a stacked die is wire bonded and the stacked-die bond wire is deflected above a dielectric ridge at the stacked die edge.