The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Feb. 26, 2019
Applied Materials, Inc., Santa Clara, CA (US);
Sriskantharajah Thirunavukarasu, Singapore, SG;
Arvind Sundarrajan, Singapore, SG;
Karrthik Parathithasan, Singapore, SG;
Qi Jie Peng, Singapore, SG;
Manorajh Arunakiri, Singapore, SG;
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
Methods for bonding and de-bonding a thin substrate film to a carrier plate are provided herein. In some embodiments, a method of processing a semiconductor substrate includes applying a polymer layer that is non-adhesive to a carrier plate formed of a dielectric material. A second layer is then applied to the polymer layer. One or more redistribution layers are then formed on the second layer. The second layer is then separated from the carrier plate via at least one of magnetic induction heating, infrared exposure, or electrostatic repulsion.