Manorajh Arunakiri

Title: Innovations by Manorajh Arunakiri

Introduction

Manorajh Arunakiri is an accomplished inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor processing. His innovative approach has led to the development of a unique patent that enhances the efficiency of substrate bonding.

Latest Patents

Manorajh holds a patent for "Adhesive-less substrate bonding to carrier plate." This patent outlines methods for bonding and de-bonding a thin substrate film to a carrier plate. In his method, a polymer layer that is non-adhesive is applied to a carrier plate made of dielectric material. Subsequently, a second layer is applied to the polymer layer, followed by the formation of one or more redistribution layers on the second layer. The innovative aspect of this method lies in the separation of the second layer from the carrier plate using techniques such as magnetic induction heating, infrared exposure, or electrostatic repulsion.

Career Highlights

Manorajh is currently employed at Applied Materials, Inc., where he continues to push the boundaries of semiconductor technology. His work has garnered attention for its potential to revolutionize the way substrates are processed in the industry.

Collaborations

He collaborates with talented coworkers, including Sriskantharajah Thirunavukarasu and Arvind Sundarrajan, who contribute to the innovative environment at Applied Materials, Inc.

Conclusion

Manorajh Arunakiri's contributions to semiconductor processing through his patent demonstrate his innovative spirit and commitment to advancing technology. His work is a testament to the impact of creativity in the field of engineering.