The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Sep. 19, 2019
Applicant:

Silicon Storage Technology, Inc., San Jose, CA (US);

Inventors:

Chunming Wang, Shanghai, CN;

Leo Xing, Shanghai, CN;

Andy Liu, Shanghai, CN;

Melvin Diao, Shanghai, CN;

Xian Liu, Sunnyvale, CA (US);

Nhan Do, Saratoga, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11521 (2017.01); H01L 27/11531 (2017.01); H01L 29/66 (2006.01); H01L 21/3213 (2006.01); H01L 27/11536 (2017.01); H01L 29/423 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66825 (2013.01); H01L 21/32133 (2013.01); H01L 21/32135 (2013.01); H01L 21/32139 (2013.01); H01L 27/11521 (2013.01); H01L 27/11531 (2013.01); H01L 27/11536 (2013.01); H01L 28/00 (2013.01); H01L 29/423 (2013.01); H01L 29/42328 (2013.01);
Abstract

A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.


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