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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10833022 B1

PDFFull Text
Date of Patent:
Nov. 10, 2020

Filed:

Oct. 16, 2019

Structure and method to improve overlay performance in semiconductor devices

Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Cung D. Tran, Niskayuna, NY (US);

Huaxiang Li, Lenox, MA (US);

Bradley Morgenfeld, Greenfield Center, NY (US);

Xintuo Dai, Rexford, NY (US);

Sanggil Bae, Clifton Park, NY (US);

Rui Chen, Clifton Park, NY (US);

Md Motasim Bellah, Malta, NY (US);

Dongyue Yang, Lawrenceville, NJ (US);

Minghao Tang, Ballston Lake, NY (US);

Christian J. Ayala, Schenectady, NY (US);

Ravi Prakash Srivastava, Clifton Park, NY (US);

Kripa Nidhan Chauhan, Clifton Park, NY (US);

Pavan Kumar Chinthamanipeta Sripadarao, Clifton Park, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:

Gibb & Riley, LLC

Anthony J. Canale

Primary Examiner:

Mohsen Ahmadi

Int. Cl.
CPC ...
G03F 9/00 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); H01L 23/544 (2006.01); H01L 21/027 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G03F 7/16 (2013.01); G03F 9/708 (2013.01); G03F 9/7076 (2013.01); G03F 9/7084 (2013.01); G03F 9/7088 (2013.01); H01L 21/0274 (2013.01); G03F 7/20 (2013.01); G03F 7/2002 (2013.01); G03F 7/70633 (2013.01); G03F 7/70683 (2013.01); H01L 23/528 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 2223/54426 (2013.01);
Abstract

In an exemplary method, a first layer is formed on a substrate. First overlay marks are formed in a first zone of the first layer. A non-transparent layer is formed on top of the first layer. At least a portion of the non-transparent layer is removed from an area above the first zone of the first layer. This provides optical access to the first overlay marks. A second layer is formed on top of the non-transparent layer. Second overlay marks are formed in a second zone of the second layer. Position information is obtained from each of the first overlay marks and the second overlay marks.

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