The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Jun. 18, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Lei Jiang, Aloha, OR (US);
Edwin B. Ramayya, Hillsboro, OR (US);
Daniel Pantuso, Portland, OR (US);
Rafael Rios, Austin, TX (US);
Kelin J. Kuhn, Aloha, OR (US);
Seiyon Kim, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/38 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/38 (2013.01); H01L 21/8238 (2013.01); H01L 27/092 (2013.01); H05K 1/181 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10166 (2013.01);
Abstract
Embodiments of the present disclosure describe techniques and configurations for integrated thermoelectric cooling. In one embodiment, a cooling assembly includes a semiconductor substrate, first circuitry disposed on the semiconductor substrate and configured to generate heat when in operation and second circuitry disposed on the semiconductor substrate and configured to remove the heat by thermoelectric cooling. Other embodiments may be described and/or claimed.