The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Jun. 24, 2014
Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Keisuke Hashimoto, Toyama, JP;

Kenji Takase, Toyama, JP;

Tetsuya Shinjo, Toyama, JP;

Rikimaru Sakamoto, Toyama, JP;

Takafumi Endo, Toyama, JP;

Hirokazu Nishimaki, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); C09D 161/22 (2006.01); C09D 161/06 (2006.01); C08G 12/08 (2006.01); G03F 7/09 (2006.01); G03F 7/40 (2006.01); C07C 39/10 (2006.01); C07C 43/178 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C07C 39/10 (2013.01); C07C 43/1785 (2013.01); C08G 12/08 (2013.01); C09D 161/06 (2013.01); C09D 161/22 (2013.01); G03F 7/091 (2013.01); G03F 7/094 (2013.01); G03F 7/40 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01);
Abstract

A resist underlayer film for use in lithography process which generates less sublimate, has excellent embeddability at the time of applying onto a substrate having a hole pattern, and has high dry etching resistance, wiggling resistance and heat resistance, etc. A resist underlayer film-forming composition including a resin and a crosslinkable compound of Formula (1) or Formula (2): in which Qis a single bond or an m1-valent organic group, Rand Rare each a Calkyl group or a Calkyl group having a Calkoxy group, Rand Rare each a hydrogen atom or a methyl group, Rand Rare each a Calkyl group or a Caryl group.


Find Patent Forward Citations

Loading…