The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Aug. 29, 2017
Applicant:

Advanced Ion Beam Technology, Inc., Hsin-Chu, TW;

Inventors:

Te-Min Wang, Tainan, TW;

Yu-Ho Ni, Tainan, TW;

Chun-Chieh Lin, Tainan, TW;

Chien-Chung Hou, Tainan, TW;

Cheng-Mao Chien, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02N 13/00 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); G01R 31/28 (2006.01); G01R 27/26 (2006.01); H05F 3/02 (2006.01);
U.S. Cl.
CPC ...
H02N 13/00 (2013.01); G01R 27/2605 (2013.01); G01R 31/2808 (2013.01); G01R 31/2831 (2013.01); H01L 21/67288 (2013.01); H01L 21/6833 (2013.01); H01L 21/68742 (2013.01); H05F 3/02 (2013.01);
Abstract

An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.


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