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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10796910 B1

PDFFull Text
Date of Patent:
Oct. 06, 2020

Filed:

Dec. 31, 2019

Method for performing a photolithography process

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tsung-Han Ko, New Taipei, TW;

Joy Cheng, Taoyuan, TW;

Ching-Yu Chang, Yuansun Village, Yilang County, TW;

Chin-Hsiang Lin, Hsinchu, TW;

Assignee:

Taiwan Semicondutor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Savitri Mulpuri

Int. Cl.
CPC ...
H01L 21/027 (2006.01); G03F 7/26 (2006.01); H01L 21/033 (2006.01); H01L 21/308 (2006.01); H01L 21/266 (2006.01); G03F 7/038 (2006.01); G03F 7/20 (2006.01); G03F 7/40 (2006.01); G03F 7/09 (2006.01); G03F 7/039 (2006.01); G03F 7/38 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0274 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/0392 (2013.01); G03F 7/094 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); G03F 7/405 (2013.01); H01L 21/0271 (2013.01); H01L 21/0273 (2013.01); H01L 21/0337 (2013.01); H01L 21/266 (2013.01); H01L 21/3086 (2013.01);
Abstract

A method for performing a photolithography process is provided. The method includes forming a layer over a substrate, and exposing a portion of the layer to form an exposed region. The method also includes performing a baking process on the layer, so that voids are formed in the exposed region of the layer. The method further includes filling the void with a post treatment coating material, and the post treatment coating material is over the exposed region of the layer.

Find Patent Forward Citations

Ko, Tsung-Han. (2020). Method for performing a photolithography process (U.S. Patent No. 10796910). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10796910

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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