The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Dec. 24, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Bruce A. Block, Portland, OR (US);

Paul B. Fischer, Portland, OR (US);

Nebil Tanzi, Hoffman Estates, IL (US);

Gregory Chance, Oberhaching, DE;

Han Wui Then, Portland, OR (US);

Sansaptak Dasgupta, Hillsboro, OR (US);

Marko Radosavljevic, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 27/20 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H03H 3/007 (2006.01); H03H 9/05 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H03H 3/02 (2006.01); H03H 9/17 (2006.01); H03H 9/56 (2006.01); H03H 9/15 (2006.01);
U.S. Cl.
CPC ...
H01L 27/20 (2013.01); H01L 23/48 (2013.01); H01L 23/66 (2013.01); H01L 24/00 (2013.01); H01L 29/2003 (2013.01); H01L 29/66462 (2013.01); H01L 29/7787 (2013.01); H03H 3/0073 (2013.01); H03H 3/02 (2013.01); H03H 9/0557 (2013.01); H03H 9/172 (2013.01); H03H 9/173 (2013.01); H03H 9/174 (2013.01); H03H 9/176 (2013.01); H03H 9/562 (2013.01); H03H 9/564 (2013.01); H03H 9/568 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H03H 2003/021 (2013.01); H03H 2003/023 (2013.01); H03H 2009/155 (2013.01);
Abstract

Techniques to fabricate an RF filter using 3 dimensional island integration are described. A donor wafer assembly may have a substrate with a first and second side. A first side of a resonator layer, which may include a plurality of resonator circuits, may be coupled to the first side of the substrate. A weak adhesive layer may be coupled to the second side of the resonator layer, followed by a low-temperature oxide layer and a carrier wafer. A cavity in the first side of the resonator layer may expose an electrode of the first resonator circuit. An RF assembly may have an RF wafer having a first and a second side, where the first side may have an oxide mesa coupled to an oxide layer. A first resonator circuit may be then coupled to the oxide mesa of the first side of the RF wafer.


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