The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Apr. 12, 2018
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

John Daugherty, Fremont, CA (US);

David Trussell, Fremont, CA (US);

Michael Kellogg, San Francisco, CA (US);

Christopher Pena, Hayward, CA (US);

Richard H. Gould, Fremont, CA (US);

Klay Kunkel, Sunol, CA (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67196 (2013.01); H01L 21/6719 (2013.01); H01L 21/67161 (2013.01);
Abstract

A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.


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