The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Mar. 05, 2019
Applicant:

Nuflare Technology, Inc., Yokohama-shi, JP;

Inventors:

Hideo Tsuchiya, Setagaya-ku, JP;

Masataka Shiratsuchi, Kawasaki, JP;

Ryoichi Hirano, Setagaya-ku, JP;

Hideaki Hashimoto, Yokohama, JP;

Riki Ogawa, Yokohama, JP;

Assignee:

NuFlare Technology, Inc., Yokohama-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 23/22 (2018.01); G01N 23/2251 (2018.01); G01N 23/2206 (2018.01); H01J 37/26 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
G01N 23/2251 (2013.01); G01N 23/2206 (2013.01); H01J 37/265 (2013.01); G01N 2223/6116 (2013.01); H01J 37/28 (2013.01); H01J 2237/004 (2013.01); H01J 2237/221 (2013.01); H01J 2237/2817 (2013.01);
Abstract

An electron beam inspection apparatus includes an acquisition processing circuitry to acquire surface material information presenting a surface material of the substrate and a value of an acceleration voltage of an electron beam; a sequence determination processing circuitry to determine a scan sequence of a plurality of stripe regions on the basis of the surface material of the substrate and the value of the acceleration voltage, the plurality of stripe regions obtained by virtually dividing an inspection region of the substrate in a stripe shape; a secondary electron image acquisition mechanism including a detector for detecting a secondary electron and configured to scan the plurality of stripe regions of the substrate according to a determined scan sequence and to acquire a secondary electron image of the substrate; and a comparison processing circuitry to compare the secondary electron image with a corresponding reference image.


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