The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Jun. 20, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

David O'Meara, Albany, NY (US);

Lior Huli, Albany, NY (US);

Soo Doo Chae, Albany, NY (US);

Wan Jae Park, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/02178 (2013.01); H01L 21/02186 (2013.01); H01L 21/02205 (2013.01); H01L 21/0332 (2013.01); H01L 21/31144 (2013.01);
Abstract

Methods are disclosed that selectively deposit a protective material on the top regions of patterned photoresist layers, such patterned EUV photoresist layers, to provide a protective cap that reduces erosion damage during etch processes used for pattern transfer. Some deposition of the protective material on the sidewalls of the patterned photoresist layer is acceptable, and any deposition of the protective material on the underlying layer below the patterned photoresist layer is preferably thinner than the deposition at the top of the photoresist pattern. Further, the selective deposition of protective caps can be implemented, for example, through the application of high-rotation speeds to spatial atomic layer deposition (ALD) techniques. The selective deposition of protective caps increases the flexibility of options to improve etch resistance for various processes/materials.


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