The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Oct. 05, 2018
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventors:
Tzyy-Jang Tseng, Taoyuan, TW;
Cheng-Ta Ko, Taipei, TW;
Kai-Ming Yang, Taoyuan, TW;
Yu-Hua Chen, Hsinchu, TW;
Assignee:
Unimicron Technology Corp., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/92 (2013.01); H01L 21/481 (2013.01); H01L 21/4846 (2013.01); H01L 23/49838 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/2957 (2013.01); H01L 2224/2969 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/81898 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/20105 (2013.01);
Abstract
A package structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The pads are disposed on the first substrate, and fill the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills the gaps between the conductive pillars. A bonding method of the package structure is also provided.