The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Jun. 24, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Glenn A. Glass, Portland, OR (US);

Ying Pang, Portland, OR (US);

Nabil G. Mistkawi, Keizer, OR (US);

Anand S. Murthy, Portland, OR (US);

Tahir Ghani, Portland, OR (US);

Huang-Lin Chao, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 21/02 (2006.01); H01L 21/8234 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/161 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823807 (2013.01); H01L 21/02532 (2013.01); H01L 21/02546 (2013.01); H01L 21/823481 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 27/0924 (2013.01); H01L 29/0653 (2013.01); H01L 29/0847 (2013.01); H01L 29/1054 (2013.01); H01L 29/161 (2013.01); H01L 29/20 (2013.01); H01L 29/6681 (2013.01);
Abstract

Techniques are disclosed for customization of fin-based transistor devices to provide a diverse range of channel configurations and/or material systems, and within the same integrated circuit die. Sacrificial fins are removed via wet and/or dry etch chemistries configured to provide trench bottoms that are non-faceted and have no or otherwise low-ion damage. The trench is then filled with desired semiconductor material. A trench bottom having low-ion damage and non-faceted morphology encourages a defect-free or low defect interface between the substrate and the replacement material. In an embodiment, each of a first set of the sacrificial silicon fins is recessed and replaced with a p-type material, and each of a second set of the sacrificial fins is recessed and replaced with an n-type material. Another embodiment may include a combination of native fins (e.g., Si) and replacement fins (e.g., SiGe). Another embodiment may include replacement fins all of the same configuration.


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