The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Aug. 29, 2017
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/768 (2006.01); C23C 18/32 (2006.01); H01L 21/288 (2006.01); C23C 18/52 (2006.01); H01L 23/522 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); H01L 21/3213 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); C23C 18/1603 (2013.01); C23C 18/1628 (2013.01); C23C 18/1692 (2013.01); C23C 18/1889 (2013.01); C23C 18/32 (2013.01); C23C 18/52 (2013.01); H01L 21/288 (2013.01); H01L 21/768 (2013.01); H01L 21/76843 (2013.01); H01L 21/76864 (2013.01); H01L 21/76865 (2013.01); H01L 21/76874 (2013.01); H01L 23/522 (2013.01); C23C 18/1651 (2013.01); H01L 21/32134 (2013.01); H01L 23/53209 (2013.01);
Abstract
A metal wiring layer can be formed within a recess of a substrate and an unnecessary plating layer is not left on a surface of the substrate. A metal wiring layer forming method includes forming a first plating layeras a protection layer at least on a tungsten or tungsten alloyformed on a bottom surfaceof a recessof a substrate; removing an unnecessary plating layerformed on a surfaceof the substrate; and forming a second plating layeron the first plating layerwithin the recess