The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Aug. 24, 2017
Applicants:

Massachusetts Institute of Technology, Cambridge, MA (US);

University of Chicago, Chicago, IL (US);

Inventors:

Do Han Kim, Melrose, MA (US);

Hyo Seon Suh, Woodridge, IL (US);

Priya Moni, Worcester, MA (US);

Karen K. Gleason, Cambridge, MA (US);

Paul Franklin Nealey, Chicago, IL (US);

Assignees:

Massachusetts Institute of Technology, Cambridge, MA (US);

University of Chicago, Chicago, IL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); C23C 16/46 (2006.01); H01L 21/311 (2006.01); H01L 21/3065 (2006.01); G03F 7/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); C23C 16/46 (2013.01); G03F 7/0002 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/31144 (2013.01); H01L 21/0228 (2013.01); H01L 21/02118 (2013.01); H01L 21/02178 (2013.01); H01L 21/02271 (2013.01); H01L 21/31138 (2013.01);
Abstract

Disclosed is a method for the fabrication of polymeric topcoat via initiated chemical vapor deposition (iCVD) or photoinitiated chemical vapor deposition (piCVD) in conjunction with directed self-assembly (DSA) of block copolymers to generate high resolution patterns. A topcoat deposited by iCVD or piCVD allows for conformal, ultra-thin, uniform, pinhole-free coatings. iCVD or piCVD topcoat enables the use of a diversity of block copolymer (BCP) materials for DSA and facilitates the direct and seamless integration of the topcoats for a pattern transfer process.


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