The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

May. 08, 2019
Applicant:

Tokyo Electron Limited, Minato-ku, Tokyo, JP;

Inventors:

Elliott Franke, Albany, NY (US);

Angelique Raley, Albany, NY (US);

Sophie Thibaut, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01); H01L 21/027 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0338 (2013.01); H01L 21/0276 (2013.01); H01L 21/02274 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/67069 (2013.01);
Abstract

Embodiments of methods and systems for patterning of low aspect ratio stacks are described. In one embodiment, a method may include receiving a substrate comprising a patterned organic planarizing layer (OPL) mask wherein a surface of the OPL mask is exposed, the OPL mask landing on a dielectric layer. The method may also include performing a partial etch of the dielectric layer in a region exposed by the OPL mask. Additionally, the method may include depositing a capping material on a surface of the OPL mask. The method may also include performing a cyclical process of the partial etch of the dielectric layer and deposition of the capping material on a surface of the OPL mask until the dielectric layer is removed to a target depth. In such embodiments, the cyclical process generates an output patterned substrate with a target line edge roughness (LER).


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