The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Aug. 11, 2017
Asml Netherlands B.v., Veldhoven, NL;
Frits Van Der Meulen, Eindhoven, NL;
Erik Johan Arlemark, Waalre, NL;
Hendrikus Herman Marie Cox, Eindhoven, NL;
Martinus Agnes Willem Cuijpers, Veldhoven, NL;
Joost De Hoogh, Eindhoven, NL;
Gosse Charles De Vries, Veldhoven, NL;
Paul Comé Henri De Wit, Eindhoven, NL;
Sander Catharina Reinier Derks, Budel, NL;
Ronald Cornelis Gerardus Gijzen, Liempde, NL;
Dries Vaast Paul Hemschoote, Vosselaar, BE;
Christiaan Alexander Hoogendam, Westerhoven, NL;
Adrianus Hendrik Koevoets, Mierlo, NL;
Raymond Wilhelmus Louis Lafarre, Helmond, NL;
Alain Louis Claude Leroux, Eindhoven, NL;
Patrick Willem Paul Limpens, Uden, NL;
Jim Vincent Overkamp, Eindhoven, NL;
Christiaan Louis Valentin, Eindhoven, NL;
Koos Van Berkel, Waalre, NL;
Stan Henricus Van Der Meulen, Helmond, NL;
Jacobus Cornelis Gerardus Van Der Sanden, Geldrop, NL;
Harmen Klaas Van Der Schoot, Haaren, NL;
David Ferdinand Vles, Eindhoven, NL;
Evert Auke Rinze Westerhuis, The Hague, NL;
ASML Netherlands B.V., Veldhoven, NL;
Abstract
A lithographic apparatus comprising a projection system configured to project a patterned radiation beam to form an exposure area on a substrate held on a substrate table, the lithographic apparatus further comprising a cooling apparatus for cooling the substrate, wherein the cooling apparatus comprises a cooling element located above the substrate table and adjacent to the exposure area, the cooling element being configured to remove heat from the substrate.