The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Aug. 17, 2018
Applicant:

Atomera Incorporated, Los Gatos, CA (US);

Inventors:

Robert John Stephenson, Duxford, GB;

Scott A. Kreps, Indian Harbour Beach, FL (US);

Robert J. Mears, Wellesley, MA (US);

Kalipatnam Vivek Rao, Grafton, MA (US);

Assignee:

ATOMERA INCORPORATED, Los Gatos, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 21/762 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/8238 (2006.01); H01L 29/10 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 29/778 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76237 (2013.01); H01L 21/3065 (2013.01); H01L 21/3083 (2013.01); H01L 21/823878 (2013.01); H01L 29/0607 (2013.01); H01L 29/0649 (2013.01); H01L 29/1054 (2013.01); H01L 29/15 (2013.01); H01L 29/152 (2013.01); H01L 29/1604 (2013.01); H01L 29/7782 (2013.01); H01L 29/7833 (2013.01); H01L 29/1083 (2013.01); H01L 29/665 (2013.01);
Abstract

A method for making a semiconductor device may include forming first and second spaced apart shallow trench isolation (STI) regions in a semiconductor substrate, and forming a superlattice on the semiconductor substrate and extending between the first and second STI regions. The superlattice may include stacked groups of layers, each group of layers including stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The method may also include forming a first semiconductor stringer comprising a non-monocrystalline body at an interface between a first end of the superlattice and the first STI region, and forming a gate above the superlattice.


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