The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Feb. 02, 2017
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Samantha Tan, Fremont, CA (US);

Wenbing Yang, Fremont, CA (US);

Keren Jacobs Kanarik, Los Altos, CA (US);

Thorsten Lill, Santa Clara, CA (US);

Yang Pan, Los Altos, CA (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30655 (2013.01); C23C 16/45536 (2013.01); C23C 16/45544 (2013.01); H01J 37/321 (2013.01); H01J 37/32009 (2013.01); H01J 37/3244 (2013.01); H01J 37/32357 (2013.01); H01J 37/32422 (2013.01); H01J 37/32651 (2013.01); H01L 21/0228 (2013.01); H01L 21/67069 (2013.01); H01J 2237/334 (2013.01);
Abstract

Methods and apparatuses for etching semiconductor material on substrates using atomic layer etching by chemisorption, by deposition, or by both chemisorption and deposition mechanisms in combination with oxide passivation are described herein. Methods involving atomic layer etching using a chemisorption mechanism involve exposing the semiconductor material to chlorine to chemisorb chlorine onto the substrate surface and exposing the modified surface to argon to remove the modified surface. Methods involving atomic layer etching using a deposition mechanism involve exposing the semiconductor material to a sulfur-containing gas and hydrogen to deposit and thereby modify the substrate surface and removing the modified surface.


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