The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Jul. 31, 2018
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Der-Chyang Yeh, Hsinchu, TW;
Hsien-Wei Chen, Hsinchu, TW;
Li-Hsien Huang, Zhubei, TW;
Yueh-Ting Lin, Taipei, TW;
Wei-Yu Chen, New Taipei, TW;
An-Jhih Su, Taoyuan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
In some embodiments, a device includes a thermal-electrical-mechanical (TEM) chip having a functional circuit, a first die attached to a first side of the TEM chip, and a first via on the first side of the TEM chip and adjacent to the first die, the first via being electrically coupled to the TEM chip. The device also includes a first molding layer surrounding the TEM chip, the first die and the first via, where an upper surface of the first die and an upper surface of the first via are level with an upper surface of the first molding layer. The device further includes a first redistribution layer over the upper surface of the first molding layer and electrically coupled to the first via and the first die.