The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Aug. 30, 2018
Applicants:

Imec Vzw, Leuven, BE;

Katholieke Universiteit Leuven, Ku Leuven R&d, Leuven, BE;

Inventors:

Emily Gallagher, Burlington, VT (US);

Roel Gronheid, Huldenberg, BE;

Jan Doise, Leuven, BE;

Iacopo Mochi, Leuven, BE;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/027 (2006.01); G03F 7/11 (2006.01); G03F 7/00 (2006.01); G03F 1/36 (2012.01); G03F 1/68 (2012.01); C09D 153/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); G03F 1/36 (2013.01); G03F 1/68 (2013.01); G03F 7/0002 (2013.01); G03F 7/11 (2013.01); H01L 21/0274 (2013.01); H01L 21/3088 (2013.01); C09D 153/005 (2013.01);
Abstract

A mask structure and a method for manufacturing a mask structure for a lithography process is provided. The method includes providing a substrate covered with an absorber layer on a side thereof; providing a patterned layer over the absorber layer, the patterned layer comprising at least one opening; and forming at least one assist mask feature in the at least one opening, wherein the at least one assist mask feature is formed by performing a directed self-assembly (DSA) patterning process comprising providing a BCP material in the at least one opening and inducing phase separation of a BCP material into a first component and a second component, the first component being the at least one assist mask feature and being periodically distributed with respect to the second component.


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