The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Oct. 28, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tien-Shun Chang, New Taipei, TW;

Chun-Feng Nieh, Hsinchu, TW;

Huicheng Chang, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 21/3215 (2006.01); H01L 21/266 (2006.01); H01L 21/308 (2006.01); H01L 21/426 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0338 (2013.01); H01L 21/0332 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01); H01L 21/266 (2013.01); H01L 21/3086 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 21/32155 (2013.01); H01L 21/426 (2013.01); H01L 21/76802 (2013.01); H01L 21/76825 (2013.01); H01L 21/76895 (2013.01);
Abstract

Embodiments described herein relate generally to methods for forming a mask for patterning a feature in semiconductor processing. In an embodiment, a dielectric layer is formed over a substrate. A mask is formed over the dielectric layer. Forming the mask includes depositing a first layer over the dielectric layer; implanting in a first implant process a dopant species through a patterned material and into the first layer at a first energy; after implanting in the first implant process, implanting in a second implant process the dopant species through the patterned material and into the first layer at a second energy greater than the first energy; and forming mask portions of the mask comprising selectively removing portions of the first layer that are not implanted with the dopant species.


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