The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Sep. 24, 2018
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Cornel Bozdog, Boise, ID (US);

Abhilasha Bhardwaj, Boise, ID (US);

Byeung Chul Kim, Boise, ID (US);

Michael E. Koltonski, Boise, ID (US);

Gurtej S. Sandhu, Boise, ID (US);

Matthew Thorum, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 21/822 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10823 (2013.01); H01L 21/8221 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/1085 (2013.01); H01L 27/10885 (2013.01);
Abstract

Integrated circuitry comprising an array comprises a plurality of conductive vias. Individual of the vias comprise an upper horizontal perimeter comprising opposing end portions. One of the opposing end portions comprises opposing straight sidewalls. The other of the opposing end portions comprises opposing curved sidewalls that join with the opposing straight sidewalls of the one opposing end portion. Other embodiments, including methods, are disclosed.


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