The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Dec. 11, 2015
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Keith William Gaff, Fremont, CA (US);

Benny Wu, Fremont, CA (US);

Eric A. Pape, Campbell, CA (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F27B 17/00 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H05B 3/00 (2006.01); H05B 3/26 (2006.01); F27D 11/02 (2006.01);
U.S. Cl.
CPC ...
F27B 17/0025 (2013.01); F27D 11/02 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H05B 3/0014 (2013.01); H05B 3/26 (2013.01);
Abstract

A semiconductor substrate support for supporting a semiconductor substrate in a plasma processing chamber includes a multi-plane heater such as a heater array comprising thermal control elements operable to tune a spatial temperature profile on the semiconductor substrate. The multi-plane heater includes at least one pair of vertically offset heating elements connected in series or parallel to control heating output in a heating zone on the substrate support. The thermal control elements can be powered by two or more power supply lines and two or more power return lines wherein each power supply line is connected to at least two of the heater zones and each power return line is connected to at least two of the heater zones.


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