The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Jun. 06, 2017
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Hiroshi Aono, Tokyo, JP;

Kuniaki Yamaguchi, Tokyo, JP;

Hiroshi Shimomoto, Tokyo, JP;

Koji Maeda, Tokyo, JP;

Tetsuya Yashima, Tokyo, JP;

Kenji Shinkai, Tokyo, JP;

Koichi Hashimoto, Tokyo, JP;

Mitsuhiko Inaba, Tokyo, JP;

Hidetatsu Isokawa, Tokyo, JP;

Hidetaka Nakao, Tokyo, JP;

Soichi Isobe, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/10 (2006.01); B24B 37/34 (2012.01); B08B 1/00 (2006.01); B08B 1/04 (2006.01); B08B 3/12 (2006.01); B24B 37/10 (2012.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
B24B 37/345 (2013.01); B08B 1/003 (2013.01); B08B 1/04 (2013.01); B08B 3/123 (2013.01); B24B 37/10 (2013.01); H01L 21/67173 (2013.01); H01L 21/67219 (2013.01); H01L 21/68707 (2013.01);
Abstract

A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.


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