The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Apr. 03, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sanka Ganesan, Chandler, AZ (US);

William James Lambert, Chandler, AZ (US);

Zhichao Zhang, Chandler, AZ (US);

Sri Chaitra Jyotsna Chavali, Chandler, AZ (US);

Stephen Andrew Smith, Laveen, AZ (US);

Michael James Hill, Gilbert, AZ (US);

Zhenguo Jiang, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H05K 1/18 (2006.01); H01L 25/10 (2006.01); H01L 25/065 (2006.01); H05K 7/02 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/4832 (2013.01); H01L 21/4853 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H05K 1/181 (2013.01); H05K 7/023 (2013.01);
Abstract

Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.


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