The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Oct. 11, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Injo Ok, Loudonville, NY (US);

Choonghyun Lee, Rensselaer, NY (US);

Soon-Cheon Seo, Glenmont, NY (US);

Sungjae Lee, Niskayuna, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/73 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/205 (2006.01); H01L 29/225 (2006.01); H01L 21/324 (2006.01); H01L 21/477 (2006.01); H01L 21/02 (2006.01); H01L 29/737 (2006.01); H01L 29/165 (2006.01);
U.S. Cl.
CPC ...
H01L 29/737 (2013.01); H01L 29/0817 (2013.01); H01L 29/0821 (2013.01); H01L 29/165 (2013.01); H01L 29/66242 (2013.01); H01L 21/02296 (2013.01); H01L 21/324 (2013.01); H01L 21/3242 (2013.01); H01L 21/477 (2013.01);
Abstract

A method of forming a silicon-germanium heterojunction bipolar transistor (hbt) device is provided. The method includes forming a stack of four doped semiconductor layers on a semiconductor substrate. The method further includes forming a dummy emitter contact and contact spacers on a fourth doped semiconductor layer of the stack of four doped semiconductor layers, and removing portions of the second, third, and fourth semiconductor layers to form a vertical fin. The method further includes recessing the second and fourth doped semiconductor layers, and depositing a condensation layer on the second, third, and fourth doped semiconductor layers. The method further includes reacting the condensation layer with the third doped semiconductor layer to form a protective segment on a condensed protruding portion.


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