The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Sep. 25, 2018
Unimicron Technology Corp., Taoyuan, TW;
Pei-Wei Wang, Taipei, TW;
Cheng-Ta Ko, Taoyuan, TW;
Yu-Hua Chen, Hsinchu, TW;
De-Shiang Liu, Taoyuan, TW;
Tzyy-Jang Tseng, Taoyuan, TW;
UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;
Abstract
A light emitting device package structure includes a substrate, a circuit layer structure, a light emitting device, a first redistribution layer, a conductive connector, a second redistribution layer, and a chip. The circuit layer structure is disposed over the substrate, and the circuit layer structure includes a first circuit layer. The light emitting device is disposed over the circuit layer structure and is electrically connected with the first circuit layer. The first redistribution layer is disposed over the light emitting device and includes a second circuit layer and a conductive contact contacting the second circuit layer. The conductive connector connects the first circuit layer and the second circuit layer. The second redistribution layer is disposed over the first redistribution layer and includes a third circuit layer contacting the conductive contact. The chip is disposed over the second redistribution layer and is electrically connected with the third circuit layer.