The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Jan. 31, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tang-Jung Chiu, Hsinchu, TW;

Hung-Chih Lin, Hsinchu, TW;

Mill-Jer Wang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01B 21/20 (2006.01); G01B 21/08 (2006.01); G01R 1/073 (2006.01); G01B 11/24 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2891 (2013.01); G01B 21/08 (2013.01); G01B 21/20 (2013.01); G01R 1/07314 (2013.01); G01R 31/2886 (2013.01); G01R 31/2896 (2013.01); G01B 11/24 (2013.01);
Abstract

A testing apparatus for testing an integrated circuit package having a plurality of electrical terminals includes a base, a socket, a plurality of conductive pins and a plurality of conductive pillars. The base includes a plurality of electrical contacts. The socket is disposed on the base and includes a bended portion bended away from the base and a plurality of through holes distributed in the socket. The conductive pins are disposed in the through holes respectively and electrically connected to the electrical contacts, wherein each of the conductive pins protrudes from an upper surface of the socket for forming temporary electrical connections with one of the electrical terminals. The conductive pillars are disposed on the base and connected to the bended portion, wherein each of the conductive pillars electrically connects one of the conductive pins and one of the electrical contacts.


Find Patent Forward Citations

Loading…