The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Oct. 04, 2017
Applicant:
Tokyo Electron Limited, Minato-ku, Tokyo, JP;
Inventors:
Ryan L. Burns, Austin, TX (US);
Benjamen M. Rathsack, Austin, TX (US);
Mark H. Somervell, Austin, TX (US);
Makoto Muramatsu, Kikuyou-cho, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/3105 (2006.01); H01L 21/02 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); G06F 17/5009 (2013.01); H01L 21/31055 (2013.01); H01L 21/02282 (2013.01); H01L 22/12 (2013.01);
Abstract
Described herein are technologies to facilitate device fabrication, especially those that involve spin-on coatings of a substrate (e.g., wafer). More particularly, technologies described herein facilitate the planarization (i.e., flatness) of spin-on coatings during the device fabrication to form a uniformly planar film or layer on the substrate. This abstract itself is not intended to limit the scope of this patent. The scope of the present invention is pointed out in the appending claims.