The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Dec. 27, 2017
Applicants:

United Microelectronics Corp., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian Province, CN;

Inventors:

Ger-Pin Lin, Tainan, TW;

Tien-Chen Chan, Tainan, TW;

Shu-Yen Chan, Changhua County, TW;

Assignees:

UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 21/265 (2006.01); H01L 29/423 (2006.01); H01L 29/08 (2006.01); H01L 21/223 (2006.01); H01L 29/167 (2006.01); H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0847 (2013.01); H01L 21/2236 (2013.01); H01L 21/26513 (2013.01); H01L 23/535 (2013.01); H01L 27/1082 (2013.01); H01L 27/10814 (2013.01); H01L 27/10823 (2013.01); H01L 27/10855 (2013.01); H01L 27/10867 (2013.01); H01L 27/10876 (2013.01); H01L 27/10885 (2013.01); H01L 27/10891 (2013.01); H01L 29/167 (2013.01); H01L 29/4236 (2013.01);
Abstract

The present invention provides a semiconductor structure, the semiconductor structure includes a substrate, at least one active area is defined on the substrate, a buried word line is disposed in the substrate, a source/drain region disposed beside the buried word line, a diffusion barrier region, disposed at the top of the source/drain region, the diffusion barrier region comprises a plurality of doping atoms selected from the group consisting of carbon atoms, nitrogen atoms, germanium atoms, oxygen atoms, helium atoms and xenon atoms, a dielectric layer disposed on the substrate, and a contact structure disposed in the dielectric layer, and electrically connected to the source/drain region.


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