The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Sep. 26, 2017
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Bernhard Grote, Phoenix, AZ (US);

Saumitra Raj Mehrotra, Scottsdale, AZ (US);

Ljubo Radic, Gilbert, AZ (US);

Vishnu Khemka, Chandler, AZ (US);

Mark Edward Gibson, Austin, TX (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7827 (2013.01); H01L 29/0653 (2013.01); H01L 29/402 (2013.01); H01L 29/407 (2013.01); H01L 29/4236 (2013.01); H01L 29/42376 (2013.01); H01L 29/66666 (2013.01); H01L 29/66704 (2013.01); H01L 29/7825 (2013.01);
Abstract

A transistor includes a trench formed in a semiconductor substrate. A gate electrode is formed in the trench with a first edge of the gate electrode proximate to a first sidewall of the trench. A first field plate is formed in the trench with the first field plate located between a second edge of the gate electrode and a second sidewall of the trench. A dielectric material is formed in the trench with the dielectric material having a first thickness between the first sidewall and a first edge of the first field plate, and a second thickness between the second sidewall and a second edge of the first field plate, the second thickness larger than the first thickness.


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