The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Oct. 15, 2018
Applicant:

Silicon Storage Technology, Inc., San Jose, CA (US);

Inventors:

Chunming Wang, Shanghai, CN;

Andy Liu, Shanghai, CN;

Xian Liu, Sunnyvale, CA (US);

Leo Xing, Shanghai, CN;

Melvin Diao, Shanghai, CN;

Nhan Do, Saratoga, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/788 (2006.01); H01L 29/423 (2006.01); H01L 27/11521 (2017.01); H01L 27/11524 (2017.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11521 (2013.01); H01L 27/11524 (2013.01); H01L 29/66825 (2013.01); H01L 29/7881 (2013.01); H01L 29/40114 (2019.08); H01L 29/42328 (2013.01); H01L 29/42332 (2013.01); H01L 29/42336 (2013.01); H01L 29/7885 (2013.01);
Abstract

A twin bit memory cell includes first and second spaced apart floating gates formed in first and second trenches in the upper surface of a semiconductor substrate. An erase gate, or a pair of erase gates, are disposed over and insulated from the floating gates, respectively. A word line gate is disposed over and insulated from a portion of the upper surface that is between the first and second trenches. A first source region is formed in the substrate under the first trench, and a second source region formed in the substrate under the second trench. A continuous channel region of the substrate extends from the first source region, along a side wall of the first trench, along the portion of the upper surface that is between the first and second trenches, along a side wall of the second trench, and to the second source region.


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