The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Dec. 21, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kalyanjit Ghosh, Pleasanton, CA (US);

Sanjeev Baluja, Campbell, CA (US);

Mayur G. Kulkarni, Bangalore, IN;

Shailendra Srivastava, Fremont, CA (US);

Tejas Ulavi, San Jose, CA (US);

Yusheng Alvin Zhou, Sunnyvale, CA (US);

Amit Kumar Bansal, Milpitas, CA (US);

Priyanka Dash, Menlo Park, CA (US);

Zhijun Jiang, Sunnyvale, CA (US);

Ganesh Balasubramanian, Fremont, CA (US);

Qiang Ma, Cupertino, CA (US);

Kaushik Alayavalli, Sunnyvale, CA (US);

Yuxing Zhang, Santa Clara, CA (US);

Daniel Hwung, Los Gatos, CA (US);

Shawyon Jafari, Sunnyvale, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/52 (2006.01); C23C 16/455 (2006.01); C23C 16/40 (2006.01); C23C 16/44 (2006.01); C23C 16/50 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32862 (2013.01); C23C 16/401 (2013.01); C23C 16/4412 (2013.01); C23C 16/4557 (2013.01); C23C 16/4585 (2013.01); C23C 16/45565 (2013.01); C23C 16/50 (2013.01); C23C 16/52 (2013.01); H01J 37/3244 (2013.01); H01J 37/32449 (2013.01); H01J 37/32513 (2013.01); H01J 37/32522 (2013.01); H01J 37/32715 (2013.01); H01J 37/32834 (2013.01); H01J 2237/3321 (2013.01);
Abstract

Systems and methods for depositing a film in a PECVD chamber while reducing residue buildup in the chamber. In some embodiments disclosed herein, a processing chamber includes a chamber body, a substrate support, a showerhead, and one or more heaters configured to heat the showerhead. In some embodiments, the processing chamber includes a controller.


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