The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Mar. 07, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masato Morishima, Tokyo, JP;

Katsuhiko Iwabuchi, Nirasaki, JP;

Takashi Fuse, Nirasaki, JP;

Madoka Fujimoto, Koshi, JP;

Daisuke Nishide, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C03C 17/42 (2006.01); C23C 16/509 (2006.01); H05H 1/46 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32532 (2013.01); C03C 17/42 (2013.01); C23C 16/509 (2013.01); H01J 37/32009 (2013.01); H05H 1/46 (2013.01); C03C 2218/152 (2013.01); H05H 2001/466 (2013.01);
Abstract

A plasma electrode is provided with an electrode plate, a ground plate, and an insulating plate arranged between the electrode plate and the ground plate. Protrusions of the electrode plate are arranged inside through holes of the ground plate and inside through holes of the insulating plate. One of the through hole provided on the center axes of the protrusions and the through hole provided around the through hole discharges a first processing gas to below the ground plate. The other of the through holes exhausts a gas existing below the ground plate. A second flow path around the protrusions supplies a second processing gas supplied via a first flow path to a gap between outer walls of the protrusions and inner walls of the through holes. The second processing gas supplied to the gap is converted into plasma by high frequency power applied to the electrode plate.


Find Patent Forward Citations

Loading…