The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Mar. 12, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Larry Frazier, Brentwood, CA (US);

Cheng-Hsiung Matthew Tsai, Cupertino, CA (US);

John C. Forster, Mountain View, CA (US);

Mei Po Yeung, San Jose, CA (US);

Michael S. Jackson, Sunnyvale, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32715 (2013.01); H01L 21/67103 (2013.01); H01L 21/68735 (2013.01); H01J 2237/334 (2013.01);
Abstract

Methods and apparatus for processing substrates are disclosed herein. In some embodiments, a substrate support to support a substrate in a processing chamber includes a dielectric insulator plate; a conductive plate supported on the dielectric insulator plate, the conductive plate comprising a top surface and a bottom surface defining a thickness between the top surface and the bottom surface, wherein an edge portion of the conductive plate tapers in a radially outward direction; and a dielectric plate comprising a substrate support surface disposed upon the top surface of the conductor plate.


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