The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Jun. 18, 2018
Applicant:

Globalfoundries, Inc., Grand Cayman, KY;

Inventors:

Yanzhen Wang, Clifton Park, NY (US);

Xinyuan Dou, Clifton Park, NY (US);

Hongliang Shen, Ballston Lake, NY (US);

Sipeng Gu, Clifton Park, NY (US);

Assignee:

GLOBALFOUNDRIES, INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0653 (2013.01); H01L 21/0217 (2013.01); H01L 21/76232 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01);
Abstract

A shallow trench isolation (STI) structure is formed from a conventional STI trench structure of a first dielectric material extending into the substrate. The conventional STI structure undergoes further processing: removing a first portion of the dielectric material and adjacent portions of the semiconductor substrate to create a first recess, and then removing another portion of the dielectric material to create a second recess in just the dielectric material. A nitride spacer layer is formed above the remaining dielectric material and on the sidewalls of the substrate. A second dielectric material is formed on the spacer layer and fills the remainder of first and second recesses to a lever above the substrate. A nitride capping layer and another dielectric layer are disposed above the second material, thereby substantially encasing the STI structure in nitride. This provides a taller STI structure that results in a better fin profile during a subsequent fin reveal process.


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