The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Jan. 08, 2018
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Tai-Yu Chen, Taipei, TW;
Wen-Sung Hsu, Hsinchu County, TW;
Sheng-Liang Kuo, Hsinchu County, TW;
Chi-Wen Pan, Taipei, TW;
Jen-Chuan Chen, Taoyuan, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/433 (2006.01); H01L 25/18 (2006.01); H01L 23/367 (2006.01); H01L 23/16 (2006.01); H01L 23/36 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/433 (2013.01); H01L 23/16 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 23/5385 (2013.01); H01L 23/562 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01L 23/3736 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor package includes a package substrate having a top surface and a bottom surface, an interposer mounted on the top surface of the package substrate, a first semiconductor die and a second semiconductor die mounted on the interposer in a side-by-side manner, and a stiffener ring secured to the top surface of the package substrate. The stiffener ring encircles the first semiconductor die and the second semiconductor die. The stiffener ring comprises a reinforcement rib striding across the interposer.